產品介紹Product introduction：
熱壓硅膠皮:
熱壓硅膠皮是一款具有高傳熱性、緩沖性和絕緣特點的通用性產品，具有優良的熱傳導性、緩沖性和極高的回彈能力，表面平整度高，主要針對各類液晶顯示模組熱壓綁定生產制程中使用、以及各類電子產品攝像頭.指紋鎖熱壓綁定生產制程中使用。
Hot pressed silicone rubber is a general-purpose product with high heat transfer, cushioning and insulation characteristics. It has excellent thermal conductivity, cushioning, high resilience and high surface flatness. It is mainly used in the hot pressing binding production process of various liquid crystal display modules and cameras of various electronic products Fingerprint lock is used in the production process of hot pressing binding.
產品型號Product models：
JD-G20 JD-G25 JD-G30 JD-G45
產品用途：
1、適用于各類LCM顯示屏（TP、TN、TFT、OLED）的熱壓邦定工藝（FOG、COG、TAB、熱壓導電膜、柔性電路板、ITO導電玻璃等），將其墊附在熱壓頭的底部表面，對溫度有傳導緩沖作用，使溫度均勻，隔離被熱壓產品與熱壓頭直接接觸，具有緩沖保護作用。
2、各種電器產品需要用到熱傳導及耐溫及絕緣作用的應用場景。
Product purpose:
1. It is applicable to the hot pressing bonding process (fog, COG, tab, hot pressing conductive film, flexible circuit board, ITO conductive glass, etc.) of all kinds of LCM display screens (TP, TN, TFT, OLED). The pad is attached to the bottom surface of the hot pressing head, which has a conductive buffer effect on the temperature, makes the temperature uniform, isolates the hot pressed products from direct contact with the hot pressing head, and has a buffer protection effect.
2.Various electrical products need application scenarios of heat conduction, temperature resistance and insulation.
產品特點：
1、極高的耐熱性和緩沖性，不給FPC、IC、玻璃及產品等帶來損傷。
2、具有超強高溫熱穩定特性和對產品的壓力一致性，使ACF導電膠導電粒子破裂更均勻。
3、極高的回復力和非粘貼性，拉伸強度大。
4、表面無粉末，高溫熱壓合不冒油。
Product features:
1. High heat resistance and cushioning, no damage to FPC, IC, glass and products.
2. It has super high temperature thermal stability and pressure consistency to the product, making the fracture of ACF conductive adhesive conductive particles more uniform.
3. Extremely high restoring force and non adhesion, high tensile strength.
4. There is no powder on the surface, and there is no oil after hot pressing at high temperature.
產品規格：
1、（厚T：0.2mm、0.25mm、0.3mm、0.45mm）*（寬W：5-1500mm）*（長L：5-50m）。
2、寬度及長度均可根據客戶需求定做。
熱壓硅膠皮性能參數表：
| model型號/項目 | JD-G20 | JD-G25 | JD-G30 | JD-G45 | 檢測方式/備注 | |
| thickness(mm) | 厚度（mm） | 0.2 | 0.25 | 0.3 | 0.45 | 厚度儀 |
| colour | 顏色 |
 灰色
|
 灰色
|
 灰色
|
 灰色
|
目測 |
| Specific gravity (g/mm3) | 比重（g/mm3） | 1.6 | 1.6 | 1.6 | 1.6 | 密度儀 |
| Hardness (a) | 硬度（A） | 70-75 | 70-75 | 70-75 | 70-75 | 邵底硬度計 |
| Temperature resistance (℃) | 耐溫（℃） | 320 | 320 | 320 | 320 | 實際使用測得 （10秒以內） |
| Elongation at break (%) | 斷裂伸長率（%） | ≥80 | ≥80 | ≥80 | ≥80 | 斷裂伸長儀 |
| Tensile strength kg / C ㎡ | 抗拉強度 kg/c㎡ | 9 | 9.3 | 9.5 | 10 | 拉力計 |
| Volume resistance (Ω. Cm) | 體積電阻（Ω.cm） | 3*1014 | 3*1014 | 3*1014 | 3*1014 | 表面電阻儀 |
| Thermal conductivity (M/MK) | 導熱系數 W/(㎡*k) | 0.4 | 0.4 | 0.4 | 0.4 | 導熱測試儀 |
| Compression set (max%) | 壓縮變形（Max%） | ≤15 | ≤15 | ≤15 | ≤15 | 壓縮變形器 |
| Recommended pressing times | 推薦壓合次數 | 10 | 10 | 10 | 10 | 測試條件：接觸面平整，280℃，30KG/㎝2 |
| Dielectric constant (F/M) | 介電常數 (F/M) | 2.1 | 2.1 | 2.6 | 3.1 | (100～1MHz) 介電常數測試儀 |
| Dielectric dissipation (S) | 介電消散 (S) | 0.002 | 0.002 | 0.002 | 0.002 | (23℃,1MHz) 介電常數測試儀 |
|
Thermogravimetric analysis (%) |
熱重分析（%） | ≤5 | ≤5 | ≤5 | ≤5 | 200℃/72H |
| Si content (%) | Si硅含量（%） | ≥80 | ≥80 | ≥80 | ≥80 | 包含SiO2 |
| material structure | 材料結構 | Si,SiO2 | Si,SiO2 | Si,SiO2 | Si,SiO2 | 主要成份 |
| 注意：以上有些數據以實驗測得，產品使用過程中會因各種條件(比如:溫度,壓力,表面粗糙度,接觸面積)不同而有所差異 Note: some of the above data are measured experimentally. During the use of the product, there will be differences due to various conditions (such as temperature, pressure, surface roughness and contact area) | ||||||
